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Silicon Wafer Back Grinding Wheel for Semiconductor Industry
On-Site Scanning
Precise Digital Duplicate
Angle Unlimited
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Reference FOB Price / Purchase Qty.
Get Latest Price
US $2,500.00
1-9
Pieces
US $2,000.00
10-99
Pieces
US $1,500.00
100+
Pieces
Type:
Thinning
Material:
Imported Diamond Abrasive
Application:
Deburring, Ferrous Metals
Viscosity:
Customized
Grit Size (JIS):
80#---1000#
Shape:
Cylindrical
Customization:
Available
|
Customized Request
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