Silicon Wafer Back Grinding Wheel for Semiconductor Industry

• Type: Thinning
• Material: Imported Diamond Abrasive
• Application: Deburring, Ferrous Metals
• Viscosity: Customized
• Grit Size (JIS): 80#---1000#
• Shape: Cylindrical
• Model NO.: Silicon wafer wheel
• Warranty: 1 Years
• Service: 7 Days/24 Hours
• Feature: Long Life
• Grinding Material: Cubic Boron Carbide
• Customized Support: OEM, ODM
• Bonding Agent: Vitrified & Resin
• Product Name: Diamond Grinding Wheel
• Package: Wooden Box
• Wheel Type: Angle Grinding Wheels
• Bond: Vitrified & Resin
• Wheel Base: Steel
• Transport Package: Wooden Boxes
• Specification: JB
• Trademark: HT
• Origin: Henan, China
• Production Capacity: 10000 Piece/Pieces Per Month

Product Description

grinding wheel

Hongtuo can provide a full range of CBN and diamond honing stones, honing tools, CBN and diamond grinding wheels, diamond dicing
blades,diamond rotary dressers and other super abrasives tools. These products are widely used in automotives, motorcycles,
aerospace, refrigerator compressor, sewing machine components, hydraulics, bearings, semiconductors, solar energy and other
industries.

 

Silicon Wafer Back Grinding Wheels

Application areas and scope of application:
It is mainly used for thinning and fine grinding of semiconductor wafers
Features:

1. Excellent grinding performance and high cost performance.
2. lt can be stably used in grinding machines made in Europe, America, Japan and China, and can replace imported products.

Product name	Silicon Wafer Back  grinding wheel	OEM	Supported
Advantage	Good performance	Size	Customized
Bond	CBN&Diamond	Grit size	Customized
OED	Supported	Package	Woonden box & cartoon box