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Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning

Name: Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
Brand: Zhengzhou Hongtuo Precision Tools Co., Ltd.
SKU: axpRQuPvogrz
Price: 1800.00 USD
Availability: InStock

Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning pictures & photos

Material:	Imported Diamond Abrasive
Viscosity:	Customized
Grit Size (JIS):	80#---1000#
Shape:	Cylindrical
Warranty:	1 Years
Size:	Customized

Customization:	Available \| Customized Request

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