Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning

Product Details
Customization: Available
Material: Imported Diamond Abrasive
Viscosity: Customized
Manufacturer/Factory & Trading Company
Gold Member Since 2024

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  • Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
  • Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
  • Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
  • Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
  • Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
  • Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
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Basic Info.

Model NO.
HT-1
Grit Size (JIS)
80#---1000#
Shape
Cylindrical
Warranty
1 Years
Size
Customized
Color
Customized
Applicable Machine
Galaxy
Service
7 Days/24 Hours
Hardness
Customized
Feature
Long Life
Customized Support
OEM, ODM
Thickness
Customized
Bonding Agent
Metal
Product Name
Diamond Grinding Wheel
Package
Wooden Box
Transport Package
Wooden Boxes
Trademark
HT
Origin
Henan, China
Production Capacity
10000 Piece/Pieces Per Month

Product Description

Products introduction 

Hongtuo can provide a full range of CBN and diamond honing stones, honing tools, CBN and diamond grinding wheels, diamond dicing blades,diamond rotary dressers and other super abrasives tools. These products are widely used in automotives, motorcycles, aerospace, refrigerator compressor, sewing machine components, hydraulics, bearings, semiconductors, solar energy and other industries.
LED epitaxial wafer thinning grinding wheel
 
Application areas and scope of application:
Mainly used in LED industry sapphire epitaxial wafer back thinning processing can be processed 2 inches, 4inches, 6inches epitaxial wafer.
Features:
1.High grinding efficiency.
2. The quality of grinding wheel is stable, and it is not easy to scrape and fragment deeply. 
3.The grinding wheel has long life and high cost performance, and can greatly reduce the processing cost of a single chip.
 
 
 
 
 
 
 
 
Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
 
Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
 
 
Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
 
Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning
Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning

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