Diamond Abrasive Wheel Metal Bond Back Thinning Wheel LED Epitaxial Wafer Thinning

• Material: Imported Diamond Abrasive
• Viscosity: Customized
• Grit Size (JIS): 80#---1000#
• Shape: Cylindrical
• Warranty: 1 Years
• Size: Customized
• Model NO.: HT-1
• Color: Customized
• Applicable Machine: Galaxy
• Service: 7 Days/24 Hours
• Hardness: Customized
• Feature: Long Life
• Customized Support: OEM, ODM
• Thickness: Customized
• Bonding Agent: Metal
• Product Name: Diamond Grinding Wheel
• Package: Wooden Box
• Transport Package: Wooden Boxes
• Trademark: HT
• Origin: Henan, China
• Production Capacity: 10000 Piece/Pieces Per Month

Product Description

Products introduction 

Hongtuo can provide a full range of CBN and diamond honing stones, honing tools, CBN and diamond grinding wheels, diamond dicing blades,diamond rotary dressers and other super abrasives tools. These products are widely used in automotives, motorcycles, aerospace, refrigerator compressor, sewing machine components, hydraulics, bearings, semiconductors, solar energy and other industries.

LED epitaxial wafer thinning grinding wheel
 

Application areas and scope of application:

Mainly used in LED industry sapphire epitaxial wafer back thinning processing can be processed 2 inches, 4inches, 6inches epitaxial wafer.

Features:

1.High grinding efficiency.

2. The quality of grinding wheel is stable, and it is not easy to scrape and fragment deeply. 

3.The grinding wheel has long life and high cost performance, and can greatly reduce the processing cost of a single chip.