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Diamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting Wheel

Name: Diamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting Wheel
Brand: Zhengzhou Hongtuo Precision Tools Co., Ltd.
SKU: hmXUrqNVaRYp
Price: 2200.00 USD
Availability: InStock

Diamond Back Grinding Wheel Customized Size Silicon Wafer Back Cutting Wheel pictures & photos

Material:	Imported Diamond Abrasive
Viscosity:	Customized
Grit Size (JIS):	80#---1000#
Shape:	Cylindrical
Warranty:	1 Years
Color:	Customized

Customization:	Available \| Customized Request

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