Ceramic Chuck Table for Dicso Machine

• Customization: Available
• Certification: ISO9001:2008
• Application: Supporting and Chucking Wafer
• Model NO.: XP
• Jaw Type: Master Jaw
• Power: Pneumatic
• Structure: Solid
• Material: Ceramic + Metal
• Type: Chuck Table
• Warranty: 6 Months
• Shape: Round or Square
• Keyword: Chuck Table
• Size: Customized Size
• Sample: Availble
• Color: Silver
• Customized Support: OEM, ODM
• MOQ: 1PCS
• Advantage: High Working Efficiency
• OEM: Accpeted
• Transport Package: Plastic Bag & Carton Box
• Trademark: hongtuo
• Origin: Henan, China

Product Description

 

Product name	Chuck table	Size	Customized
Usage	Supporting and chucking wafer	Sample	Supported
Features	High flatness	MOQ	1PCS
OEM	Support	Type	Ceramic sucker mental sucker

Ceramic chuck tables
Fine-pore ceramic chuck tables are mainly used to support and chuck the semiconductor wafer when grinding and dicing,It is appliedin the process of thining,dicing,cleaning,transportation and so on.These products which have high cost performance produced by our institute can maych with the machines made in Japan,Germany,Israel,America and China.

Features
1.High flatness and parallelish
2.Compact and uniform microstructure with high strength
3.Good permeability and uniform adsorption affinity
4.Dressing easily

 

workpiece processed: 2,3,4,5,6,8,12 inches semiconductor wafer
Suitable devices: Wafer grinder,dicing machine and cleaning machine,etc
Chuck type: Fine-pore ceramic