Porous Vacuum Magnetic Chuck Table for Semiconductor Wafer on Dicing Saw

• Customization: Available
• Certification: ISO9001:2015
• Application: Dicing Saw Machine
• Model NO.: customized
• Jaw Type: External Jaw
• Power: Pneumatic
• Structure: Solid
• Material: Stainless Steel
• Type: 30*30*2
• Item: Metal Chuck Table
• Warranty: 1year
• Advantage: Imporved Efficiency
• OEM: OEM Welcomed
• Sample: Sample Provided
• Size: Customers′ Requirment
• Feature: High Efficiency
• Customized Support: OEM
• Transport Package: Carton Box or Wooden Case.
• Trademark: HONGTUO
• Origin: Henan, China
• Production Capacity: 1000 Piece/Pieces Per Year

Product Description

 

Chuck table

Our porous ceramic and metal chuck table is a specially designed tool for water absorption and holding purposed during the
production of semiconductor wafers. It is mainly used in back grinding and dicing processes. The back grinding chuck tables and
dicing chuck tables work well with Japanese, German and Chinese dicing saws and back grinding machines, thus ensuring an excellent
cost effectiveness..we export these series chuck to Japan,Germany and some other countries.


Features

1. This wafer chuck provides a high flatness and depth of parallelism.
2. It is compact in structure, uniform size and high strength.
3. It features a well-distributed absorption capacity.
4. The dicing accessory is easy to dress.

Applications

6, 8 and 12 inch semiconductor wafers

Applicable Machines

Back grinding machines, dicing saws, DISCO DFD641

Type
Ceramic,Metal

Product name	chuck table	OEM	Supported
Advantage	Good performance	Size	Customized
Bond	Ceramic,Metal	Grit size	Customized
OED	Supported	Package	Woonden box & cartoon box