Hot Selling Silicon Wafer Diamond Back Cutting Wheel Thinning Wheels

• Material: Diamond
• Abrasive: Superabrasive
• Shapes: Thinning
• Types: Cylindrical Grinding Wheel
• Grain Size: 280#
• Cylindricity: <0.05
• Model NO.: HT-1
• Circular Degree: <0.05
• Technics: Sinter
• Working Style: Surface Grinding
• Grit Size (JIS): 80#-1000#
• Shape: Cylindrical
• Warranty: 1 Years
• Service: 7 Days/24 Hours
• Feature: Long Life
• Grinding Material: Cubic Boron Carbide
• Customized Support: OEM, ODM
• Bonding Agent: Vitrified & Resin
• Product Name: Diamond Grinding Wheel
• Package: Wooden Box
• Wheel Type: Angle Grinding Wheels
• Bond: Vitrified & Resin
• Wheel Base: Steel
• Application: Deburring, Ferrous Metals
• Width: Customized
• Transport Package: Wooden Boxes
• Specification: JB
• Trademark: HT
• Origin: Henan, China
• Production Capacity: 10000 Piece/Pieces Per Month

Product Description

 

Product Description

Hongtuo can provide a full range of CBN and diamond honing stones, honing tools, CBN and diamond grinding wheels, diamond dicing blades,diamond rotary dressers and other super abrasives tools. These products are widely used in automotives, motorcycles, aerospace, refrigerator compressor, sewing machine components, hydraulics, bearings, semiconductors, solar energy and other industries.

Product name	Backing thinning grinding wheel	OEM	Supported
Advantage	Good performance	Size	Customized
Bond	CBN&Diamond	Grit size	Customized
OED	Supported	Package	Woonden box & cartoon box