Resin Bond Diamond Dicing Blade for Semiconductor Industry

• Customization: Available
• Certification: ISO9001
• Tooth Form: Alternate Tooth
• Model NO.: HT-RM
• Diameter: 58mm
• Function: Cutting
• Shape: Hole Saw Blade
• Coating: Uncoated
• Type: Diamond Saw Blade
• Warranty: 3 Months
• Sample: Availble
• Grade: 180-1000#
• Material: Diamond
• Feature: Long Life High Performance
• Customized Support: OEM, ODM
• MOQ: 3PCS
• Packing: Standard Carton Box
• Product Name: Dicing Blades
• Application: Cutting of Optical Glass
• Finishing: Diamond
• Process Type: Dicing
• Teeth Per Inch: Customized
• Transport Package: Carton Box
• Specification: HT-RM
• Trademark: HT
• Origin: Henan

Product Description

Metal Bond QS-RM Series Dicing Blades

QS-RM series of cutting blade selection of imported diamond powder and metal sintering. This series of blade has strong
controlling ability and high wear resistance, it is suitable for precision cutting and slotting machining of electronic components
and optical components.Applications:
Optical glass, ceramics, ferrite, quartz, packaging material, etc.

Features
1. Strong diamond holding ability of metal bond.
2. High wear resistance.
3. Long service life, good shape, can inhibit the oblique
cutting & the occurrence of serpentine shape cutting.

Product Name	Dicing blades	Features	Long life & High wear resistance.
Abrasive	Diamond	Applications	Glass, ceramics, ferrite, quartz etc
Bond Type	Metal & Resin	Sample	Available
Size	Customized	Grit size	400-5000#