Diamond Dicing Metal Bond RM Series Blades for Semiconductor Industry

• Customization: Available
• Material: Diamond
• Abrasive: Natural Abrasives
• Model NO.: RM&RB
• Shapes: Edge Shape
• Types: Cutting Wheel
• Grain Size: 240#
• Cylindricity: <0.02
• Circular Degree: <0.05
• Technics: Sinter
• Working Style: Cutting
• Type: Abrasive Disc
• Machining Way: Cutting
• Warranty: 6 Months
• Advantage: High Working Efficiency
• Product Name: Diamond Dicing Blades
• Size: Customized
• Characteristic: Precision
• Application: Glass
• Customized Support: OEM, ODM
• MOQ: 1 PCS
• Certificate: ISO
• Transport Package: Carton or Wooden Box
• Specification: HT-RB
• Trademark: HT
• Origin: Henan, China
• Package Size: 14.00cm * 8.00cm * 9.00cm
• Package Gross Weight: 0.500kg

Product Description

 

Product Description

Metal Sintered Diamond Dicing Blades HT-RM series for Optical glass, ceramics, ferrites, crystals

The HT-RM series metal sintered blade - also called a metal bond blade-is one of our most wear resistant and enduring dicing blades. This diamond tool is sintered from a combination of diamond powders and metal bonds. It comes with excellent form holding characteristics, and an extremely high wear resistance, making it ideal for cutting and slotting of electronic and optical components.
These metal sintered dicing blades have become an ideal dicing cutter for optical glass, ceramics, ferrite and crystals. For more details, please browse the specific product pages or contact us directly. Rest assured that we can provide the right diamond cutting wheel for your needs.

Features
1. Our metal bond dicing blades have exceptional diamond holding capabilities and an extreme wear rate, providing a much longer service life.
2. The great form holing performance enables it to prevent oblique or S-shaped cutting.

Dicing Objects:
Optical glass, ceramics, ferrites, crystals and more

Specifications:

Detailed Photos