Customization: | Available |
---|---|
Type: | Thinning |
Material: | Diamond Abrasive |
Suppliers with verified business licenses
Audited by an independent third-party inspection agency
Product name
|
Silicon Wafer Back grinding wheel
|
OEM
|
Supported
|
Advantage
|
Good performance
|
Size
|
Customized
|
Bond
|
Diamond
|
Grit size
|
Customized
|
OED
|
Supported
|
Package
|
Woonden box & cartoon box
|