Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning

• Customization: Available
• Type: Thinning
• Material: Diamond Abrasive
• Model NO.: Silicon wafer wheel
• Effect: Polishing
• Grit Size (JIS): 80#---1000#
• Shape: Cylindrical
• Warranty: 1 Years
• Service: 7 Days/24 Hours
• Feature: Long Life
• Grinding Material: Cubic Boron Carbide
• Customized Support: OEM, ODM
• Bonding Agent: Vitrified & Resin
• Product Name: Diamond Grinding Wheel
• Package: Wooden Box
• Wheel Type: Angle Grinding Wheels
• Bond: Vitrified & Resin
• Wheel Base: Steel or Aluminium
• Transport Package: Wooden Boxes
• Specification: JB
• Trademark: HT
• Origin: Henan, China
• Production Capacity: 10000 Piece/Pieces Per Month

Product Description

 

Silicon Wafer Back Grinding Wheels
 

Application areas and scope of application:
It is mainly used for thinning and fine grinding of semiconductor wafers

Features:
1. Excellent grinding performance and high cost performance.
2. lt can be stably used in grinding machines made in Europe, America, Japan and China, and can replace imported products.

Product name	Silicon Wafer Back  grinding wheel	OEM	Supported
Advantage	Good performance	Size	Customized
Bond	Diamond	Grit size	Customized
OED	Supported	Package	Woonden box & cartoon box