Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning

Product Details
Customization: Available
Type: Thinning
Material: Diamond Abrasive
Manufacturer/Factory & Trading Company
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  • Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
  • Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
  • Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
  • Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
  • Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
  • Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
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Basic Info.

Model NO.
Silicon wafer wheel
Effect
Polishing
Grit Size (JIS)
80#---1000#
Shape
Cylindrical
Warranty
1 Years
Service
7 Days/24 Hours
Feature
Long Life
Grinding Material
Cubic Boron Carbide
Customized Support
OEM, ODM
Bonding Agent
Vitrified & Resin
Product Name
Diamond Grinding Wheel
Package
Wooden Box
Wheel Type
Angle Grinding Wheels
Bond
Vitrified & Resin
Wheel Base
Steel or Aluminium
Transport Package
Wooden Boxes
Specification
JB
Trademark
HT
Origin
Henan, China
Production Capacity
10000 Piece/Pieces Per Month

Product Description

Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
 

Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning

Silicon Wafer Back Grinding Wheels
 
Application areas and scope of application:
It is mainly used for thinning and fine grinding of semiconductor wafers

Features:
1. Excellent grinding performance and high cost performance.
2. lt can be stably used in grinding machines made in Europe, America, Japan and China, and can replace imported products.
Product name
Silicon Wafer Back  grinding wheel
OEM
Supported
Advantage
Good performance
Size
Customized
Bond
Diamond
Grit size
Customized
OED
Supported
Package
Woonden box & cartoon box
Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer ThinningOuter Diameter 350mm Silicon Back Grinding Wheels for Wafer ThinningOuter Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
 
Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
 
Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
Outer Diameter 350mm Silicon Back Grinding Wheels for Wafer Thinning
 

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