Factory Supply Sample Available Silicon Wafer Back Grinding Wheel

• Material: Imported Diamond Abrasive
• Viscosity: Customized
• Grit Size (JIS): 80#---1000#
• Shape: Cylindrical
• Warranty: 1 Years
• Hardness: Customized
• Model NO.: HT-1
• Feature: Long Life
• Grinding Material: Cubic Boron Carbide
• Customized Support: OEM, ODM
• Bonding Agent: Vitrified & Resin
• Product Name: Diamond Grinding Wheel
• Package: Wooden Box
• Wheel Type: Angle Grinding Wheels
• Bond: Vitrified & Resin
• Wheel Base: Steel
• Application: Deburring, Ferrous Metals
• Transport Package: Wooden Boxes
• Trademark: HT
• Origin: Henan, China
• Production Capacity: 10000 Piece/Pieces Per Month

Product Description

Products introduction 

Hongtuo can provide a full range of CBN and diamond honing stones, honing tools, CBN and diamond grinding wheels, diamond dicing blades,diamond rotary dressers and other super abrasives tools. These products are widely used in automotives, motorcycles, aerospace, refrigerator compressor, sewing machine components, hydraulics, bearings, semiconductors, solar energy and other industries.

Silicon Wafer Back Grinding Wheels

Application areas and scope of application:

 

It is mainly used for thinning and fine grinding of semiconductor wafers

Features:

 

1. Excellent grinding performance and high cost performance.
2. lt can be stably used in grinding machines made in Europe, America, Japan and China, and can replace imported products.

 

 

 

 

 

PRODUCT DESCRIPTION

 Wheel Shape

Wheel shape & specification can be totally customized based on customers' requirements

 

 

 

 

 

PACKING & SHIPPING

FAQ