Metal Bond Diamond Dicing Blade for IC Packaging BGA Material

Product Details
Customization: Available
Certification: ISO9001
Tooth Form: Alternate Tooth
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  • Metal Bond Diamond Dicing Blade for IC Packaging BGA Material
  • Metal Bond Diamond Dicing Blade for IC Packaging BGA Material
  • Metal Bond Diamond Dicing Blade for IC Packaging BGA Material
  • Metal Bond Diamond Dicing Blade for IC Packaging BGA Material
  • Metal Bond Diamond Dicing Blade for IC Packaging BGA Material
  • Metal Bond Diamond Dicing Blade for IC Packaging BGA Material
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Basic Info.

Model NO.
Dicing blade
Function
Cutting
Shape
Hole Saw Blade
Coating
Uncoated
Type
Diamond Saw Blade
Warranty
3 Months
Blade Length
Customized
Size
Customized
Sample
Availble
Grade
Industrial
Material
Diamond
Feature
Long Life High Performance
Customized Support
OEM, ODM
MOQ
3PCS
Packing
Standard Carton Box
Product Name
Dicing Blades
Application
Cutting of Optical Glass
Finishing
Diamond
Process Type
Dicing
Teeth Per Inch
Customized
Transport Package
Carton Case/Wooden Case
Specification
HT-RB
Trademark
HT
Origin
Henan

Product Description

Metal Bond Diamond Dicing Blade for IC Packaging BGA Material
Metal Bond Diamond Dicing Blade for IC Packaging BGA Material
Metal Bond Diamond Dicing Blade for IC Packaging BGA Material

Metal Bond QS-RM Series Dicing Blades

QS-RM series of cutting blade selection of imported diamond powder and metal sintering. This series of blade has strong
controlling ability and high wear resistance, it is suitable for precision cutting and slotting machining of electronic components
and optical components.Applications:
Optical glass, ceramics, ferrite, quartz, packaging material, etc.

Features
1. Strong diamond holding ability of metal bond.
2. High wear resistance.
3. Long service life, good shape, can inhibit the oblique
cutting & the occurrence of serpentine shape cutting.
Product Name
Dicing blades
Features
Long life & High wear resistance.
Abrasive
Diamond
Applications
Glass, ceramics, ferrite, quartz etc
Bond Type
Metal & Resin
Sample
Available
Size
Customized
Grit size
400-5000#
Metal Bond Diamond Dicing Blade for IC Packaging BGA Material
 
 
 
 
 
Metal Bond Diamond Dicing Blade for IC Packaging BGA MaterialMetal Bond Diamond Dicing Blade for IC Packaging BGA MaterialMetal Bond Diamond Dicing Blade for IC Packaging BGA MaterialMetal Bond Diamond Dicing Blade for IC Packaging BGA MaterialMetal Bond Diamond Dicing Blade for IC Packaging BGA Material
 
 
Metal Bond Diamond Dicing Blade for IC Packaging BGA Material
Metal Bond Diamond Dicing Blade for IC Packaging BGA Material
 
Metal Bond Diamond Dicing Blade for IC Packaging BGA Material
 

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